Key Features

Calibrated tack, not just "sticky enough" Measured at 800D (16), the adhesive grabs submicron dust and solder fines without transferring anything back to copper traces, solder mask, or optical coatings. Strong enough to work, controlled enough not to cause damage.

Uniform film thickness across the full roll 50 µm measured result against a 47 µm ± 3 spec. No thin spots, no skip-cleaning on critical flat-panel or semiconductor surfaces. The 8 µm ± 2 µm adhesive layer stays consistent from the first pass to the last.

Halogen-free - verified by third-party lab Fluorine, Chlorine, Bromine, and Iodine all confirmed Not Detected (below 10 mg/kg) by ion chromatography per EN 14582:2016. Safe for halogen-sensitive flex circuits, automotive PCBs, and precision printing substrates where chloride ions corrode metal layers.

Peel force that protects your surface Average peel adhesion of 446 gf/25mm, within the specified 412–479 gf/25mm range. Particles lift cleanly without delaminating copper traces, displacing solder paste deposits, or marking optical coatings.

Zero bubbles, zero defect transfer Confirmed bubble-free by visual inspection. A bubble on the adhesive surface becomes a gap in coverage - and a gap in coverage on an LCD or light guide film shows up as a bright spot in the finished panel.

PCB Cleaning Roller in use

Product Specifications

Parameter	Specification
Model	WN38
Material	PE (polyethylene)
Color	Milky white
Roll length	18 m
Max width	≤ 1000 mm
Base film thickness	47 µm ± 3
Adhesive layer thickness	8 µm ± 2 µm
Core inner diameter	38 mm ± 0.2
Initial tack	800D (14–16)
Peel adhesion (avg)	412–479 gf/25mm
Packaging	10 rolls / pack · 100 rolls / carton

Quality Inspection Results

Inspection method: in-house QC. Inspector: A1. Reviewed by:

Item	Test Method	Specification	Result	Verdict
Color	Visual	Milky white	Milky white	Pass
Thickness	Thickness gauge	47 µm ± 3	50 µm	Pass
Inner diameter	Vernier caliper	38 mm ± 0.2	38 mm	Pass
Bubbles	Visual	None	None	Pass
Initial tack	Tack tester	800D (14–16)	800D (16)	Pass
Peel force (avg)	Electronic peel tester	412–479 gf/25mm	446 gf/25mm	Pass
Overall verdict			Inspection passed

Halogen Test Results

Standard: EN 14582:2016. Method: Ion chromatography (IC). Sample: blue adhesive plastic film, mixed test (Sample ID: 001).

Element	Result	Detection Limit
Fluorine (F)	N.D.	10 mg/kg
Chlorine (Cl)	N.D.	10 mg/kg
Bromine (Br)	N.D.	10 mg/kg
Iodine (I)	N.D.	10 mg/kg

N.D. = Not Detected (below method detection limit). Test conducted on a mixed sample of two film specimens as specified by client.

Application Scenarios

PCB and SMT lines

Used between solder paste printing and component placement. The roller picks up solder fines, flux splatter, and stray particles from bare boards before they cause bridging or open joints after reflow. Works on both rigid FR4 and flexible polyimide substrates.

LCD panels and light guide films

Dust on LCD glass or light guide films creates mura defects and bright spots visible in the finished panel. The bubble-free, uniform film makes full-width contact in a single pass - replacing multiple wipe passes that risk scratching optical surfaces.

Semiconductor substrates and cleanroom pre-process

Before lamination or coating on semiconductor substrates, micro-particles must be removed without introducing ionic contamination. The halogen-free PE material (all halogens N.D.) makes it compatible with cleanroom use where chloride or fluoride ions would corrode metal interconnects.

Soft film and precision printing

Screen and flexographic printers use it to decontaminate film substrates before ink application. Particles trapped under the substrate cause hickies and registration loss. A single roll-down before each print run catches what compressed air blowoffs leave behind.

Glass panels, press steel plates, and workbenches

Dust settling on lamination press plates migrates into bonded stacks and causes voids. Rolling the steel plate surface before clamping prevents particle inclusion without adding a wet cleaning step that requires drying time.

Real-Use Examples

SMT line: reducing solder ball defects on a 6-layer board A contract manufacturer running high-density 6-layer PCBs saw intermittent solder ball rejects after reflow. After adding a WN38 roller pass on bare boards between screen printing and pick-and-place, the 800D (16) tack level captured stray solder fines without disturbing existing paste deposits. Defect rate dropped on the first day of trial with no line speed change.

Flex circuit production: halogen-free compliance documentation Flexible circuit suppliers shipping to automotive customers must document halogen content throughout their process. Because WN38 reports all halogens N.D. per EN 14582:2016, it can be included in the process BOM without affecting the product's halogen declaration - a direct advantage when certifying to IEC 61249-2-21 or responding to customer RoHS questionnaires.

Frequently Asked Questions

Q: Will the roller leave adhesive residue on copper traces or solder mask?

A: No. The 446 gf/25mm peel force is calibrated to lift particles without transferring adhesive. PE-based adhesives at 800D tack do not wet-out onto metal pads or solder mask the way aggressive tapes do. If you see any transfer, check whether the roller has been contaminated with silicone from a previous process step.

Q: What particle sizes does it capture?

A: The adhesive film effectively captures particles from large visible debris down to fine dust in the 5–50 µm range - the size range most responsible for solder bridging, panel mura, and print hickies. For cleanrooms below ISO Class 5, the roller works best as a pre-stage before HEPA-blown rinses or final wipers, not as a standalone cleanroom tool.

Q: The halogen test used a mixed-sample method. Does that affect RoHS compliance?

A: The test mixed two film specimens as specified by the client. The report note states that results may differ from any single homogeneous material. For formal RoHS substance declarations, request a single-material test certificate. The mixed-sample N.D. result is a strong indicator that the adhesive formulation contains no halogenated compounds, but it is not a substitute for a material-level REACH or RoHS declaration.

Q: Can the roller be used on ENIG surfaces?

A: Yes. The 446 gf/25mm peel force is well below the adhesion strength of properly deposited ENIG finishes, and the halogen-free formula introduces no chloride ions that could accelerate nickel corrosion. Always spot-test on a non-critical coupon first when introducing any adhesive product to a new surface finish.

Q: How many passes does one 18 m roll provide, and when should I advance to a fresh section?

A: Coverage per pass depends on board or panel length. As a general guide, advance to a fresh section when particles are visibly re-depositing - the adhesive surface will look loaded under inspection lighting. On high-volume SMT lines, most teams advance every 50–100 board passes. The 47 µm base film provides enough layers to advance frequently without the roll collapsing on its 38 mm core.

Q: Can it handle panels wider than 1000 mm?

A: The standard maximum roll width is ≤ 1000 mm. For wider panels, two overlapping passes or a custom-width order are the practical options. The 38 mm inner diameter fits standard 6-inch mandrels on most in-line cleaning roller machines, so no custom fixtures are needed for standard SMT or flat-panel equipment.

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